Qualitas H3C UniServer R6900 G5

Description:

Highlights High euismod High Reliability, High Scalability
Nova generatio H3C UniServer R6900 G5 architectura modularis adoptat ut capacitatem scalabilem capacitatem praestantem ad 50 SFF sustinentem includat ad libitum 24 NVMe SSD agitet.
R6900 G5 lineamenta server in Enterprise-gradu RAS facere honestam electionem pro core inposuit, virtualisation Database, processus notitiae et applicationis densitatis summus computans.
H3C UniServer R6900 G5 recentissimis utitur 3 Gen Intel® Xeon® Processus Scalable.(Cedar Island), 6 UPI Bus connexionis et memoria DDR4 cum 3200MT/s velocitate necnon PMem 200 series novae memoriae permanentes ad perficiendum fortiter extollunt usque ad 40% cum praecedenti suggestu.Cum 18 x PCIe3.0 I/O foramina ad optimam IO scalam pervenies.
94%/96% potentia efficientiae et 5~45℃ temperamentum operans praebent utentes TCO redeunt in centrum viridius.

QUAESTIO NOW whatsapp EMAIL

Product Detail

Product Tags

R6900 G5 est optimized pro ambitus:

- Virtualization - Suscipe multa genera nucleorum laboratorum in uno servo ad simpliciorem rationem infra-investendam.
- Magna Data - Curo exponentialem incrementum notitiarum structarum, informarum et semi- structarum.
- Data warehouse/analysis - Query data in demanda ad auxilium servitium consilium
- Customer relatio procuratio (CRM) - Adiuva te ut comprehendas pervestigationes in negotio data ad meliorem satisfactionem et fidem.
- Enterprise resource consilio (ERP) - Crede R6900 G5 ut operas in reali tempore administrare adiuvare possis
- High-perficiendi computandi et profundae eruditionis - Provide satis GPUs ad apparatus eruditionis et AI applicationes
- R6900 G5 sustinet Microsoft® Windows® et Linux systemata operantem, nec non VMware et H3C CAS et perfecte operari potest in ambitus IT heterogeneis.

Specificatio technica

cpu	4 x 3 generation Intel® Xeon® Cooper Lake SP series (Quisque processus usque ad 28 nucleos et maximum 250W potentia consummatio)
Chipset	Intel® C621A
Memoria	48 DDR4 DIMM foramina, maximum 12.0 TB * usque ad 3200 MT/s notitia translationis rate et sustentatio tam RDIMM quam LRDIMMUp ad 24 Intel ® Optane™ DC Memoria Module PMem 200 series Persistentes (Barlow Pass)
Storagecontroller	RAID controller (SATA RAID 0, 1, 5, and 10) Standard Plu HBA cards et repositionis moderatoris, secundum exemplar.
FBWC	8 GB DDR4 cache, secundum exemplar, subsidium supercapacitor tutelae
Repono	Maximum Front 50SFF, Support SAS/SATA HDD/SSD DrivesMaximum 24 front U.2 NVMe DrivesSATA M.2 SSDs/2 SD pecto, secundum exemplar
Network	1 onboard 1 Gbps administratione retis portOCP 3.0 × 16 foramen apertum ad instituendum 4 1GE portus aeris/2 10GE/2 x 25GE fibra portsStandard Plu 3.0 Aer AdaptersPCIe Latin foramina pro 1/10/25/40/100GE/IB Ethernet Adapter .
Plu foramina	18 Plu 3.0 FH vexillum foramina
Portus	VGA connexiones (Front et Tergo) et Vide portum (RJ-45) 6 USB 3.0 connexiones (2 antica, 2 postrema, 2 interna) 1 dedicata iungo procuratio.
GPU	IX unius socors latum seu III duplex socors latum GPU modulorum
Optical coegi	Externi orbis optici coegi , libitum
Management	HDM (procuratio cum dicata portu) et H3C PUGNA, auxilium LCD tactus captiosus exemplar
Securitas	Intelligentes Front Securitatis Bezel * Support Chassis intrusionem DetectionTPM2.0Silicon Radix spera Duo-factor logging auctoritate
Potentia copia	Support 4 Platinum 1600W* (sustentat 1+1/2+2 redundantia) ,800W -48V DC potentia copia (1+1/2+2 redundantia) 8 Hot swappable fans
Signa	CE.UL FCC，VCCI EAC, etc.
Operating Temperature	5°C ad 45°C (41°F ad 113°F) Maxima temperatura operans variatur a configuratione servo.Pro maiori, documenta technica pro fabrica vide.
Dimensiones (H *×W D)	4U HeightWithout pignus bezel: 174.8 447 799 mm (6.88 17.59 31.46 in) Cum securitate bezel: 174.8 447 830 mm (6.88 17.59 32.67 in)